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Procédé d'intégration de matériaux 2D sur un substrat nanostructuré, film mince suspendu de matériaux 2D et utilisation associées

Abstract : A method of integrating two-dimensional materials onto a nanostructured substrate, characterised in that it comprises the following steps: manufacturing the two-dimensional materials by means of a vapour deposition or an exfoliation method; and transferring the two-dimensional materials obtained in the previous step onto a synthesised nanostructured substrate that is selected such that a contact surface between the two-dimensional materials and the nanostructured substrate is minimised. The invention further relates to fully suspended thin films obtained by the above method, and to the use of the suspended thin films in various fields such as electronics, optoelectronics, photovoltaics, catalysis, ultrasensitive surfaces, integrated circuits etc.
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https://hal-utt.archives-ouvertes.fr/hal-03141889
Contributor : Jean-Baptiste Vu Van Connect in order to contact the contributor
Submitted on : Monday, February 15, 2021 - 3:49:32 PM
Last modification on : Wednesday, September 15, 2021 - 3:03:28 PM

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  • HAL Id : hal-03141889, version 1

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UTT | CNRS

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Gilles Lerondel, Hyun Jeong, Gokarna Anisha. Procédé d'intégration de matériaux 2D sur un substrat nanostructuré, film mince suspendu de matériaux 2D et utilisation associées. France, N° de brevet: FR3060023 (A1). 2018. ⟨hal-03141889⟩

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