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Conference papers

Thermomechanical vibration of PCB and component assembly

Ayda Halouani 1 Mariem Miladi Chaabane 2 Mohamed Haddar 2 Abel Cherouat 1, 3
1 Gamma3 - Automatic mesh generation and advanced methods
Inria Saclay - Ile de France, ICD - Institut Charles Delaunay
2 ENIS - École Nationale d'Ingénieurs de Sfax | National School of Engineers of Sfax
3 UTT - Université de Technologie de Troyes
Abstract : This study investigates the effect of vibration loading. A tow dimensional finite element model of the printed circuit board (PCB) and the plastic ball grid array (PBGA) component assembly is released to investigate the effect of harmonic excitation on the solder ball response.
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Conference papers
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https://hal-utt.archives-ouvertes.fr/hal-02572200
Contributor : Jean-Baptiste Vu Van Connect in order to contact the contributor
Submitted on : Wednesday, May 13, 2020 - 3:19:29 PM
Last modification on : Wednesday, September 15, 2021 - 3:17:20 PM

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  • HAL Id : hal-02572200, version 1

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INRIA | UTT | CNRS | GS-COMPUTER-SCIENCE

Citation

Ayda Halouani, Mariem Miladi Chaabane, Mohamed Haddar, Abel Cherouat. Thermomechanical vibration of PCB and component assembly. Second International Conference on Acoustics and Vibration, Mar 2018, Hammamet, Tunisia. ⟨hal-02572200⟩

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