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Conference papers

Thermomechanical vibration of PCB and component assembly

Abstract : This study investigates the effect of vibration loading. A tow dimensional finite element model of the printed circuit board (PCB) and the plastic ball grid array (PBGA) component assembly is released to investigate the effect of harmonic excitation on the solder ball response.
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Conference papers
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https://hal-utt.archives-ouvertes.fr/hal-02572200
Contributor : Jean-Baptiste Vu Van <>
Submitted on : Wednesday, May 13, 2020 - 3:19:29 PM
Last modification on : Thursday, June 11, 2020 - 4:19:22 AM

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  • HAL Id : hal-02572200, version 1

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Ayda Halouani, Mariem Miladi Chaabane, Mohamed Haddar, Abel Cherouat. Thermomechanical vibration of PCB and component assembly. Second International Conference on Acoustics and Vibration, Mar 2018, Hammamet, Tunisia. ⟨hal-02572200⟩

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