Thermomechanical vibration of PCB and component assembly

Ayda Halouani; Mariem Miladi Chaabane; Mohamed Haddar; Abel Cherouat

Conference papers

Thermomechanical vibration of PCB and component assembly

Ayda Halouani ¹ Mariem Miladi Chaabane ² Mohamed Haddar ² Abel Cherouat ^{1, 3}

1 Gamma3 - Automatic mesh generation and advanced methods

ICD - Institut Charles Delaunay, Inria Saclay - Ile de France

2 ENIS - École Nationale d'Ingénieurs de Sfax | National School of Engineers of Sfax

3 UTT - Université de Technologie de Troyes

Abstract : This study investigates the effect of vibration loading. A tow dimensional finite element model of the printed circuit board (PCB) and the plastic ball grid array (PBGA) component assembly is released to investigate the effect of harmonic excitation on the solder ball response.

Document type :

Conference papers

Domain :

Engineering Sciences [physics]

Complete list of metadatas

https://hal-utt.archives-ouvertes.fr/hal-02572200
Contributor : Jean-Baptiste Vu Van <>
Submitted on : Wednesday, May 13, 2020 - 3:19:29 PM
Last modification on : Thursday, June 11, 2020 - 4:19:22 AM

Thermomechanical vibration of PCB and component assembly

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Thermomechanical vibration of PCB and component assembly

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