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Study of the uniformity of 300mm wafer through ring- resonator analysis

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Abstract

The uniformity of a 300mm wafer has been analyzed through the study of resonant wavelength of ring resonators. SOI thickness variation can be compensated with the use of Ti-TiN heater.
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Dates and versions

hal-02453137 , version 1 (23-01-2020)

Identifiers

  • HAL Id : hal-02453137 , version 1

Cite

C. Chauveau, P. Labeye, J.-M. Fedeli, Sylvain Blaize, Gilles Lerondel. Study of the uniformity of 300mm wafer through ring- resonator analysis. International Conference on Photonics in Switching (PS), Sep 2012, Ajaccio, France. ⟨hal-02453137⟩
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