Abstract : The uniformity of a 300mm wafer has been analyzed through the study of resonant wavelength of ring resonators. SOI thickness variation can be compensated with the use of Ti-TiN heater.
https://hal-utt.archives-ouvertes.fr/hal-02453137
Contributor : Daniel Gavrysiak <>
Submitted on : Thursday, January 23, 2020 - 4:26:27 PM Last modification on : Thursday, June 11, 2020 - 5:04:09 PM
C. Chauveau, P. Labeye, J.-M. Fedeli, Sylvain Blaize, Gilles Lerondel. Study of the uniformity of 300mm wafer through ring- resonator analysis. International Conference on Photonics in Switching (PS), Sep 2012, Ajaccio, France. ⟨hal-02453137⟩