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Conference papers

Study of the uniformity of 300mm wafer through ring- resonator analysis

Abstract : The uniformity of a 300mm wafer has been analyzed through the study of resonant wavelength of ring resonators. SOI thickness variation can be compensated with the use of Ti-TiN heater.
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Conference papers
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https://hal-utt.archives-ouvertes.fr/hal-02453137
Contributor : Daniel Gavrysiak <>
Submitted on : Thursday, January 23, 2020 - 4:26:27 PM
Last modification on : Thursday, June 11, 2020 - 5:04:09 PM

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  • HAL Id : hal-02453137, version 1

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Citation

C. Chauveau, P. Labeye, J.-M. Fedeli, Sylvain Blaize, Gilles Lerondel. Study of the uniformity of 300mm wafer through ring- resonator analysis. International Conference on Photonics in Switching (PS), Sep 2012, Ajaccio, France. ⟨hal-02453137⟩

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