Skip to Main content Skip to Navigation
Conference papers

A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints

Ayda Halouani 1, 2 Abel Cherouat 1, 2 Mariem Miladi Chaabane 3 Mohamed Haddar 3
1 Gamma3 - Automatic mesh generation and advanced methods
ICD - Institut Charles Delaunay, Inria Saclay - Ile de France
2 UTT - Université de Technologie de Troyes
3 ENIS - École Nationale d'Ingénieurs de Sfax | National School of Engineers of Sfax
Document type :
Conference papers
Complete list of metadatas
https://hal-utt.archives-ouvertes.fr/hal-02278339
Contributor : Daniel Gavrysiak <>
Submitted on : Wednesday, September 4, 2019 - 12:26:48 PM
Last modification on : Wednesday, January 20, 2021 - 4:47:54 PM

Identifiers

  • HAL Id : hal-02278339, version 1

Collections

CNRS | INRIA | ROSAS | UTT

Citation

Ayda Halouani, Abel Cherouat, Mariem Miladi Chaabane, Mohamed Haddar. A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints. EuroSimE 2019 - 20th International Conference in Thermal, Mechanical & Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems, Mar 2019, Hannover, Germany. pp.1-6. ⟨hal-02278339⟩

Export

BibTeX TEI DC DCterms EndNote

Share

Metrics

Record views

61