A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints

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https://hal-utt.archives-ouvertes.fr/hal-02278339
Contributor : Daniel Gavrysiak <>
Submitted on : Wednesday, September 4, 2019 - 12:26:48 PM
Last modification on : Monday, October 14, 2019 - 4:09:16 PM

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  • HAL Id : hal-02278339, version 1

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Ayda Halouani, Abel Cherouat, Mariem Miladi Chaabane, Mohamed Haddar. A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints. 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Mar 2019, Hannover, Germany. pp.1-6. ⟨hal-02278339⟩

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