A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints - Université de technologie de Troyes Access content directly
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A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints

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Thermics [physics.class-ph]

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https://hal-utt.archives-ouvertes.fr/hal-02278339

Submitted on : Wednesday, September 4, 2019-12:26:48 PM

Last modification on : Friday, March 24, 2023-2:53:12 PM

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hal-02278339 , version 1 (04-09-2019)

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  • HAL Id : hal-02278339 , version 1

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Ayda Halouani, Abel Cherouat, Mariem Miladi Chaabane, Mohamed Haddar. A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints. EuroSimE 2019 - 20th International Conference in Thermal, Mechanical & Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems, Mar 2019, Hannover, Germany. pp.1-6. ⟨hal-02278339⟩

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