Conference Papers
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https://hal-utt.archives-ouvertes.fr/hal-02278339
Submitted on : Wednesday, September 4, 2019-12:26:48 PM
Last modification on : Friday, March 24, 2023-2:53:12 PM
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- HAL Id : hal-02278339 , version 1
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Ayda Halouani, Abel Cherouat, Mariem Miladi Chaabane, Mohamed Haddar. A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints. EuroSimE 2019 - 20th International Conference in Thermal, Mechanical & Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems, Mar 2019, Hannover, Germany. pp.1-6. ⟨hal-02278339⟩
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