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A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints

Ayda Halouani 1, 2 Abel Cherouat 1, 2 Mariem Miladi Chaabane 3 Mohamed Haddar 3 
1 Gamma3 - Automatic mesh generation and advanced methods
ICD - Institut Charles Delaunay, Inria Saclay - Ile de France
2 UTT - Université de Technologie de Troyes
3 ENIS - École Nationale d'Ingénieurs de Sfax | National School of Engineers of Sfax
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Conference papers
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https://hal-utt.archives-ouvertes.fr/hal-02278339
Contributor : Daniel Gavrysiak Connect in order to contact the contributor
Submitted on : Wednesday, September 4, 2019 - 12:26:48 PM
Last modification on : Sunday, June 26, 2022 - 4:50:28 AM

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  • HAL Id : hal-02278339, version 1

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CNRS | INRIA | INRIA2 | UNIV-PARIS-SACLAY | UTT | GS-COMPUTER-SCIENCE

Citation

Ayda Halouani, Abel Cherouat, Mariem Miladi Chaabane, Mohamed Haddar. A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints. EuroSimE 2019 - 20th International Conference in Thermal, Mechanical & Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems, Mar 2019, Hannover, Germany. pp.1-6. ⟨hal-02278339⟩

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