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A new Approach in Residual Stresses Analysis by Speckle Interferometry

Abstract : The knowledge of residual stresses allows a reliable prediction of structure performances evolution, such as service life [1-3]. In this paper, we develop a new method for residual stresses determination combining Electronic Speckle Pattern Interferometry (ESPI) with the machining of a groove. The internal stress field is perturbed as the depth of the groove is increased incrementally. The structure finds a new equilibrium state generating displacements which are measured using ESPI. This method was tested on an aluminium alloy AU4G plate treated locally by an ultrasonic shot-peening. The investigation of the images obtained with the phase shifting technique and fringe patterns, makes it possible to analyze, simultaneously, the stress profile along two directions: along the depth of the structure, and along the groove direction.
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Contributor : Jean-Baptiste VU VAN Connect in order to contact the contributor
Submitted on : Monday, September 2, 2019 - 9:50:56 AM
Last modification on : Sunday, June 26, 2022 - 4:47:34 AM





Afaf Maras, Guillaume Montay, Olivier Sicot, Emmanuelle Rouhaud, Manuel François. A new Approach in Residual Stresses Analysis by Speckle Interferometry. Materials Science Forum, Trans Tech Publications Inc., 2006, 524-525, pp.465-470. ⟨10.4028/⟩. ⟨hal-02275902⟩



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